Products
Pipe End Cap
Size
1/2"-72"
Wall Thickness
SCH10,SCH20,SCH30,STD,SCH40,SCH60,XS,SCH80,SCH100,SCH120,SCH140,
SCH160,XXS
Standard
ASTMA234,ASTM A420,ANSI B16.9/B16.28/B16.25,ASME B16.9,
JIS B2311-1997/2312, JIS B2311/B2312, DIN 2605-1/2617/2615,
GB 12459-99,EN Standard etc.
Material
CARBON STEEL:A234 WPB WPC,A420 WPL3 WPL6,MSS SP75 SP44,A106,WPHY42
WPHY46 WPHY52 WPHY56 WPHY60 WPHY65 WPHY70,A350,A333,ST37.0,ST35.8,
ST37.2,ST35.4/8,ST42,ST45,ST52,ST52.4
ALLOY STEEL:A234 WP5, WP9,WP11,WP12,WP22,WP91,A182 F12,P11,F22,F5,F9,F91
A335 P12,P11,P22,P5,P9,P91
STAINLESS STEEL:A403 WP304,304L,316,316L,321,321L,310,347H,A182 F304,F304L
,F316L,F316,F321,F347H,F310,F44
Stainless Steel Caps, Carbon Steel Pipe Caps, Alloy Steel Pipe Caps, Steel Pipe Caps Cangzhou Weiheng Pipe Industry Co.,Ltd , http://www.czweiheng.com
LED prices are falling frequently. In fact, the price drop is good or bad. If the price falls to a sweet spot, it may cause a reverse growth, but if the price falls too fast, the manufacturer may have to work hard. Guo Ziling, an analyst at the Industrial and Technological Research Center (IEK), said that reducing LED production costs has become an important issue for manufacturers, including the latter package, heat dissipation and driver ICs, which will be three important issues for manufacturers to reduce costs.
Guo Ziling pointed out that from the recent years, international manufacturers have cut into the back-end packaging and oriented toward unpackaged products, and whether the cost of packaging can be reduced has become the key to profitability of manufacturers. In addition, from the LED upstream and downstream industry chain, the highest value is not in the light source, but in the back-end lighting, so the big manufacturers are focused on the back-end layout.
The low price of LEDs has prompted manufacturers to actively reduce costs. Guo Ziling said that the proportion of packaging and cooling costs in LED components is the highest, accounting for more than 60. It has become an important direction for manufacturers to reduce costs. It is estimated that the packaging cost must be reduced by at least 50 in 2016. The rapid development of the LED industry and the continued profitability of the manufacturers. In this regard, the listed company Jingdian has developed ELC non-packaging technology, which only needs wafers, phosphors and encapsulants, eliminating the need for lead frames, wire bonding, etc., can be used directly in SMT, in addition to reducing costs, products With the advantage of large illumination angle, there is a chance to save the use of secondary optical lenses in the future.
TSMC solid-state lighting introduces PoP non-package technology, which directly flips the flip chip on the heat sink substrate, omits the lead frame and wire bonding process, and has the advantages of small size and higher luminous flux. It is suitable for directional light source applications and has easy color mixing. And regulate color temperature.
In addition, the driver IC accounts for 20% of the cost of LEDs, which will also be the key to cost reduction. It is a combination of opto-electronics and non-isolated architecture, which is beneficial to save costs.